| Customization: | Available |
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| Type: | Combining Rigid Circuit Board |
| Dielectric: | FR-4 |
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Item | Specifications | ||
Double side | Multi-layer Board | ||
No.of Layer | 2 | 4~16 | |
Coppor foil thickness | 0.5~3.0OZ | 0.5~3.0OZ | |
Material thickness | 0.4~2.0mm | 0.6~2.0mm | |
Flammability Grade | 94V-0 | 94V-0 | |
Peel Strength | 12.3N/cm | 12.3N/cm | |
Bow/Twist | ≤0.7% | ≤0.7% | |
Surface Resistivity | ≥1011Ω | ≥1011Ω | |
E-TEST Voltage | 100DCV | 100-200DCV | |
Max. panel size | 560×610mm | 560×610mm | |
Min. line width/spacing | 0.1/0.1mm | 0.1/0.1mm | |
Min. thickness of
Hole-wall copper | ≥25um | ≥25um | |
Min. Ring | Inner layer | 0.1mm | |
Extend layer | 0.1mm | 0.1mm | |
Min. hole size | 0.25mm | 0.25mm | |
Tolerance of
Hole size | PTH | ±0.076mm | ±0.076mm |
NPTH | ±0.055mm | ±0.055mm | |
Tolerance of Hole’s location | ±0.076mm | ±0.076mm | |
Tolerance of outline size | Routing | ±0.15mm | ±0.15mm |
Min.width of soldermask bridge | ≥0.1mm | ≥0.1mm | |
Soldermask Hardness Testing | 6H | 6H | |
Soldering Test | 245℃5 Sec. | 245℃5 Sec. | |
Thermal Stress Testing | 288℃10 Sec. | 288℃10 Sec. | |
Surface Treatment | OSP/HASL/Immersion Gold/Flash gold/ Flux | OSP/HASL/Immersion Gold/Flash gold/ Flux | |
Quality Standard | IPC-A-600FIPC-ML-950 | IPC-A-600FIPC-ML-950 | |
Sampling Plan | STD-105E Class Ⅱ | STD-106E Class Ⅱ | |
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