Customization: | Available |
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Structure: | Double-Sided FPC |
Material: | Polyimide |
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Number of Layers | Single Sided, Double Sided, Multilayer,Rigid-flex PCB |
Based Material | PI, PET |
Custom Made: | OEM/customize |
Flexible layers | 1~4layer |
Minimum Trace and Space | 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm |
Minimum Space between
Coverlay Openings | 0.2mm |
Minimum Space between
Coverlay and Solder pad | 0.15mm |
Polyimide Films | 0.5 mil (12.5), 1 mil (25), 2 mils (50), 3 mils (75),4mils(100), 5 mils(125) as custmer requested |
Thermobond Adhesives | Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
Copper Foils (RA or ED) | 1/3oz (12), 1/2oz (18), 1oz (35), 2oz (70) |
Surface Finish | Electroless Ni/Au, Electrolytic soft/hard gold,Tin plating,,Imm.Tin,Entek/OSP |
Solder Resists | Coverlay, Photo-Imagable Resist |
Copper Plated Thickness(PTH only) | 8~15um;20~30um;30~70um(special) |
Minimum space between
coverlay and conductor | ± 0.15mm |
Minimum conductor edge to | ≥0.1mm |
outline edge | |
Au thickness | Electroless Ni/Au
Ni:2~6um;Au:0.035~0.075um |
Electrolyticsoft/hardgoldNi:2~9um;Au:0.035~0.1um |